Delivering 13 A and 600 V per circuit, the KK® 396 reflow process compatible (RPC) connector system supports a lead free solder process and is ideal for low to mid power wire to board and board to board applications. Electronics manufacturers are being driven by consumers and environmental agencies to be environmentally conscious; one way to do so is to reduce the amount of lead-in components whenever possible. Removing lead from the connector solder paste process is one way to conform and adhere to RoHS initiatives. KK® RPC connectors are lead free and designed with high temperature nylon that can withstand temperatures up to 260 deg C while maintaining the standard KK header footprint (lead filled solder paste process connectors withstand only up to 235 deg C).
Molex® KK® 396 Crimp Housing, Standard, Series: 2139, 5 Positions, 1 Row, 3.96 mm Pitch/Row Spacing, 26 to 18 AWG Wire, Receptacle Connector, 1.141 sq-mm Connector, -40 to 80/-40 to 105 deg C, For Use With: 2478 24 to 18 AWG Crimp Terminal, 2578 26 to 22 Crimp Terminal, Specifications: 600 V, 13 A, 10 mOhm Contact, 1000 MOhm Insulation, Brass Contact, 10.7 N Mating, 3.4 N Unmating, 1.6 mm THK PCB, Nylon, Nickel Plated, Natural, 0.776 in L x 0.25 in W x 0.625 in H Dimensions
Color | : | Natural |
Connector Size | : | 1.141 sq-mm |
Connector Type | : | Receptacle |
Dimensions | : | 0.776 in L x 0.25 in W x 0.625 in H |
Finish | : | Nickel Plated |
Series | : | 2139 |
Specifications | : | 600 V, 13 A, 10 mOhm Contact, 1000 MOhm Insulation, Brass Contact, 10.7 N Mating, 3.4 N Unmating, 1.6 mm THK PCB |
Suitable For Use With | : | 2478 24 to 18 AWG Crimp Terminal, 2578 26 to 22 Crimp Terminal |
Temperature Rating | : | -40 to 80/-40 to 105 deg C |
Type | : | Standard |
Number of Positions | : | 5 |
Number of Rows | : | 1 |
Pitch/Row Spacing | : | 3.96 mm |
Wire Size | : | 26 to 18 AWG |
Material | : | Nylon |